Use of substituted Bis(acetylacetone)ethylenediimine and dialkyldithiocarbamate ligands for copper chelation in supercritical carbon dioxide.

Chemical-mechanical planarization (CMP) is a process of oxidizing and chelating the copper overburden present in an interconnect device while mechanically polishing the surface of the wafer. Because the use of condensed CO2 as the solvent for CMP would be environmentally and technically advantageous...

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Bibliographic Details
Main Authors: Dunbar, Andrew., Omiatek, Donna., Thai, Susan., Kendrex, Christopher., Grotzinger, Laurel., Boyko, Walter., Weinstein, Randy., Skaf, Dorothy., Bessel, Carol., Denison, Ginger., DeSimone, Joseph.
Format: Villanova Faculty Authorship
Language:English
Published: 2006
Online Access:http://ezproxy.villanova.edu/login?url=https://digital.library.villanova.edu/Item/vudl:179227