Natural convection and passive heat rejection from two heat sources maintained at different temperatures on a printed circuit board.

Natural convection and passive heat rejection from two independent heat sources maintained at different temperatures~60 degreesC and 100 degreesC above ambient) on single circuit boards (FR4 and copper clad FR4) are experimentally studied. The effect of heat source location on maximum power dissipation is presented for both horizontal and vertical orientations. Heat losses due to radiation, natural convection and board conduction are quantified. As long as the heat sources are more than 2 cm apart, they do not influence each other on the FR4 board. Vertical orientation increases the power dissipation in the components by up to 30% for the FR4 board and 15% for the copper clad board. Two ounces of copper cladding increases the overall power dissipation by 150-190%.

Main Author: Weinstein, Randy.
Other Authors: Fleischer, Amy., Krug, Kimberly.
Language: English
Published: 2004
Online Access: http://ezproxy.villanova.edu/login?url=https://digital.library.villanova.edu/Item/vudl:179179
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dc_source_str_mv Journal of Electronic Packaging 126, 2004, 14-21.
author Weinstein, Randy.
author_facet_str_mv Weinstein, Randy.
Fleischer, Amy.
Krug, Kimberly.
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Fleischer, Amy.
Krug, Kimberly.
author_s Weinstein, Randy.
spellingShingle Weinstein, Randy.
Natural convection and passive heat rejection from two heat sources maintained at different temperatures on a printed circuit board.
author-letter Weinstein, Randy.
author_sort_str Weinstein, Randy.
author2 Fleischer, Amy.
Krug, Kimberly.
author2Str Fleischer, Amy.
Krug, Kimberly.
dc_title_str Natural convection and passive heat rejection from two heat sources maintained at different temperatures on a printed circuit board.
title Natural convection and passive heat rejection from two heat sources maintained at different temperatures on a printed circuit board.
title_short Natural convection and passive heat rejection from two heat sources maintained at different temperatures on a printed circuit board.
title_full Natural convection and passive heat rejection from two heat sources maintained at different temperatures on a printed circuit board.
title_fullStr Natural convection and passive heat rejection from two heat sources maintained at different temperatures on a printed circuit board.
title_full_unstemmed Natural convection and passive heat rejection from two heat sources maintained at different temperatures on a printed circuit board.
collection_title_sort_str natural convection and passive heat rejection from two heat sources maintained at different temperatures on a printed circuit board.
title_sort natural convection and passive heat rejection from two heat sources maintained at different temperatures on a printed circuit board.
description Natural convection and passive heat rejection from two independent heat sources maintained at different temperatures~60 degreesC and 100 degreesC above ambient) on single circuit boards (FR4 and copper clad FR4) are experimentally studied. The effect of heat source location on maximum power dissipation is presented for both horizontal and vertical orientations. Heat losses due to radiation, natural convection and board conduction are quantified. As long as the heat sources are more than 2 cm apart, they do not influence each other on the FR4 board. Vertical orientation increases the power dissipation in the components by up to 30% for the FR4 board and 15% for the copper clad board. Two ounces of copper cladding increases the overall power dissipation by 150-190%.
publishDate 2004
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fgs.label Natural convection and passive heat rejection from two heat sources maintained at different temperatures on a printed circuit board.
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dc.title Natural convection and passive heat rejection from two heat sources maintained at different temperatures on a printed circuit board.
dc.creator Weinstein, Randy.
Fleischer, Amy.
Krug, Kimberly.
dc.description Natural convection and passive heat rejection from two independent heat sources maintained at different temperatures~60 degreesC and 100 degreesC above ambient) on single circuit boards (FR4 and copper clad FR4) are experimentally studied. The effect of heat source location on maximum power dissipation is presented for both horizontal and vertical orientations. Heat losses due to radiation, natural convection and board conduction are quantified. As long as the heat sources are more than 2 cm apart, they do not influence each other on the FR4 board. Vertical orientation increases the power dissipation in the components by up to 30% for the FR4 board and 15% for the copper clad board. Two ounces of copper cladding increases the overall power dissipation by 150-190%.
dc.date 2004
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dc.source Journal of Electronic Packaging 126, 2004, 14-21.
dc.language en
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